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| product structure silicon monolithic integrated circuit this product is not designed protection against radioactive rays 1/12 tsz02201-0h1h0b100480-1-2 ? 2012 rohm co., ltd. all rights reserved. 18.dec.2012 rev.002 tsz22111 ~ 14~ 001 datashee t www.rohm.com dc brushless motor drivers for cooling fans two-phase half-wave pre driver fan motor driver BA6406F ? general description BA6406F is two-phase half-wave fan motor pre-driver. this driver incorporates lock protection, automatic restart circuit and lock alarm signal output. ? features ? incorporates lock protection ? automatic restart circuit ? lock alarm signal (al) output ? package w (typ.) x d (typ.) x h (max.) sop8 5.00mm x 6.20mm x 1.71mm ? application ? for desktop pc, server, general consumer equipment, communication equipment and industrial equipment. ? absolute maximum ratings parameter symbol limit unit supply voltage vcc 30 v power dissipation pd 624 *1 mw operating temperature topr ?40 to +100 c storage temperature tstg ?55 to +125 c output current iomax 70 ma al signal output current ial 8 ma al signal output voltage val 30 v junction temperature tjmax 125 c *1 reduce by 6.24mw/c over ta=25c. (on 70.0mm70.0mm1.6mm glass epoxy board) ? recommended operating conditions parameter symbol limit unit operating supply voltage range vcc 4.0 to 28.0 v hall input voltage range vh 1.0 to vcc-0.5 v sop8
product structure silicon monolithic integrated circuit this product is not designed protection against radioactive rays 2/12 datasheet datasheet tsz02201-0h1h0b100480-1-2 ? 2012 rohm co., ltd. all rights reserved. 18.dec.2012 rev.002 tsz22111 ~ 14~ 001 BA6406F www.rohm.com ? pin configuration ? pin description p/no. t/name function 1 vcc power terminal 2 h+ hall input terminal + 3 al lock alarm signal output terminal 4 h- hall input terminal - 5 gnd gnd terminal 6 ld lock detection and automatic restart capacitor connecting terminal 7 a1 output terminal 1 8 a2 output terminal 2 ? block diagram ? i/o truth table h+ h- a1 a2 h l h(output tr on) l(output tr off) l h l(output tr off) h(output tr on) h; high, l; low, hi-z; high impedance fg output is open-drain type. motor state al rotating l locking hi-z l; low, hi-z; high impedance al output is open-drain type. fig.2 block diagram fig.1 pin configuration (top view) ld a l h- h+ vcc a 1 a 2 1 2 3 4 7 8 6 5 gnd logic 1 2 3 4 8 7 6 5 lock detect auto restart reg vcc h+ a l h- gnd ld a 1 a 2 + - hall amp + - + - product structure silicon monolithic integrated circuit this product is not designed protection against radioactive rays 3/12 datasheet datasheet tsz02201-0h1h0b100480-1-2 ? 2012 rohm co., ltd. all rights reserved. 18.dec.2012 rev.002 tsz22111 ~ 14~ 001 BA6406F www.rohm.com ? electrical characteristics(unless otherwise specified ta=25c, vcc=12v) parameter symbol limit unit conditions min. typ. max. circuit current icc - 3.2 5.0 ma at output off hall input hysteresis vhys ? 3- 15mv al output l voltage val - - 0.5 v ial=5ma al current capacity ial 8.0 - - ma val=2v charge current of capacitor for lock detection ildc 2.0 3.45 5.25 a vld=1.5v discharge current of capacitor for lock detection ildd 0.35 0.80 1.45 a vld=1.5v charge-discharge current ratio of capacitor for lock detection rcd 3 4.5 8 - rcd=ildc/ildd clamp voltage of capacitor for lock detection vldcl 2.2 2.6 3.0 v comparison voltage of capacitor for lock detection vldcp 0.4 0.6 0.8 v output h voltage voh 10 10.5 - v io=10ma product structure silicon monolithic integrated circuit this product is not designed protection against radioactive rays 4/12 datasheet datasheet tsz02201-0h1h0b100480-1-2 ? 2012 rohm co., ltd. all rights reserved. 18.dec.2012 rev.002 tsz22111 ~ 14~ 001 BA6406F www.rohm.com 0 1 2 3 4 5 0 6 12 18 24 30 supply voltage, vcc [v] cir cu it cu rre nt, icc [ma] ? ? q??? ( ????? ) -1.0 0.0 1.0 2.0 3.0 4.0 5.0 0 6 12 18 24 30 supply voltage, vcc [v] charge/discharge current, ildc/ildd [ua] -1.0 0.0 1.0 2.0 3.0 4.0 5.0 0 6 12 18 24 30 supply voltage, vcc [v] charge/discharge current, ildc/ildd [ua] -1.0 0.0 1.0 2.0 3.0 4.0 5.0 0 6 12 18 24 30 supply voltage, vcc [v] charge/discharge current, ildc/ildd [ua] -1.0 0.0 1.0 2.0 3.0 4.0 5.0 0 6 12 18 24 30 supply voltage, vcc [v] charge/discharge current, ildc/ildd [ua] 0.0 0.2 0.4 0.6 0.8 1.0 0246810 al current, ial[ma] al low voltage, vall [v] -20 -10 0 10 20 0 6 12 18 24 30 supply voltage, vcc [v] hall input hysteresis, vhys [mv] -40 ? 100? 25? fig.3 circuit current operating voltage range fig.4 hall input hysteresis -40 ? 100? 25? 25? -40 ? 100? operating voltage range fig.5 al output l voltage 100? 25? -40 ? fig.6 charge-discharge current of capacitor for lock detection operating voltage range 100? 25? -40 ? -40 ? 100? 25? ildc ildd product structure silicon monolithic integrated circuit this product is not designed protection against radioactive rays 5/12 datasheet datasheet tsz02201-0h1h0b100480-1-2 ? 2012 rohm co., ltd. all rights reserved. 18.dec.2012 rev.002 tsz22111 ~ 14~ 001 BA6406F www.rohm.com -5.0 -4.0 -3.0 -2.0 -1.0 0.0 0 20406080 ou tput curre nt, io [ma] output voltage, voh [v] 0.0 1.0 2.0 3.0 4.0 5.0 0 6 12 18 24 30 supply voltage, vcc [v] clamp/comparate voltage, vldcl/vldcp [v] fig.7 clamp-comparison voltage of capacitor for lock detection 100? 25? -40 ? fig.8 output h voltage 100? 25? -40 ? vldcl vldcp 25? -40 ? 100? product structure silicon monolithic integrated circuit this product is not designed protection against radioactive rays 6/12 datasheet datasheet tsz02201-0h1h0b100480-1-2 ? 2012 rohm co., ltd. all rights reserved. 18.dec.2012 rev.002 tsz22111 ~ 14~ 001 BA6406F www.rohm.com ? application circuit example(constant values are for reference) substrate design note a) ic power, motor outputs, and motor ground lines are made as fat as possible. b) ic ground (signal ground) line is common with the applic ation ground except motor grou nd (i.e. hall ground etc.), and arranged near to (?) land. c) the bypass capacitor and/or zenner diode are arrangement near to vcc terminal. d) h+ and h? lines are arranged side by side and made from the hall element to ic as shorter as possible, because it is easy for the noise to influence the hall lines. fig.9 application circuit take a measure against vcc voltage rise generated by reverse connection of current and back electrom otive force. set according to the amplitude of hall element output and hall input voltage range. connect a pull-up resistor because open collector output is set. lock detection on time and lock detection off time can be set. output tr is equipped externally. provide a back electromotive force regenerating current route by zenner diode for clamping. hall logic 1 2 3 4 8 7 6 5 lo ck detect au t o restart reg vcc h+ al h- gnd ld a1 a2 + - ha ll amp + - + - 0.33 f ? 4.7 f product structure silicon monolithic integrated circuit this product is not designed protection against radioactive rays 7/12 datasheet datasheet tsz02201-0h1h0b100480-1-2 ? 2012 rohm co., ltd. all rights reserved. 18.dec.2012 rev.002 tsz22111 ~ 14~ 001 BA6406F www.rohm.com ? description of operations 1) lock protection and automatic restart cr timer system charging and discharging time at ld terminal depends on the capacitor equipped externally on ld terminal. charging and discharging time is determined as follows: c capacity of capacitor equipped externally on ld terminal + ldcl ld terminal clamping voltage + ldcp ld terminal comparator voltage ldc ld terminal charging current ldd ld terminal discharging current timing chart of ld terminal is shown in fig.10. fig.10 lock protection (cr timer system) timing chart ton(charging time) = c (vldcl-vldcp) ildc toff(discharging time)= c (vldcl-vldcp) ildd h- moto r locking lock detection lock release a1 ld terminal clamping voltage al(for BA6406F) ld recovers normal operation output tr off ton high(open collector) toff on fg(for ba6506f) ld terminal comparato r voltage product structure silicon monolithic integrated circuit this product is not designed protection against radioactive rays 8/12 datasheet datasheet tsz02201-0h1h0b100480-1-2 ? 2012 rohm co., ltd. all rights reserved. 18.dec.2012 rev.002 tsz22111 ~ 14~ 001 BA6406F www.rohm.com ? thermal derating curve power dissipation (total loss) indicates the power that can be consumed by ic at ta = 25oc (normal temperature). ic is heated when it consumes power, and t he temperature of ic chip becomes hi gher than ambient temperature. the temperature that can be accepted by ic chip depends on circ uit configuration, manufacturi ng process, etc, and consumable power is limited. power dissipation is determined by the tem perature allowed in ic chip (maximum junction temperature) and thermal resistance of package (heat dissipation capability). the maximum junction temperature is in general equal to the maximum value in the storage temperature range. heat generated by consumed power of ic is radiated from t he mold resin or lead frame of package. the parameter which indicates this heat dissipation capability (hardness of heat re lease) is called heat resistance, represented by the symbol ja [ ? /w]. the temperature of ic inside the package can be estimat ed by this heat resistance. fig.11 shows the model of heat resistance of the package. heat resistance ja, ambient temperature ta, junction temperature tj , and power consumption p can be calculated by the equation below: ja 1 (tj ta) / p [ ? /w] thermal derating curve indicates power that can be consumed by ic with reference to ambient temperature. power that can be consumed by ic begins to attenuate at certain ambient temper ature. this gradient is determined by thermal resistance ja. thermal resistance ja depends on chip size, power consumption, pack age ambient temperature, packaging condition, wind velocity, etc., even when the same package is used. therma l derating curve indicates a reference value measured at a specified condition. fig.56 shows a thermal derating curve (value when mount ing fr4 glass epoxy board 70 [mm] x 70 [mm] x 1.6 [mm] (copper foil area below 3 [%])) ? equivalent circuit 1) hall input terminal 2) output terminal 3)al signal output terminal pd (mw ) 700 600 500 400 300 200 100 0 25 50 75 100 125 150 ta( ?) 95 BA6406F 624 800 780 8 5 ja = (tj-ta) / p [ ? /w] fig.11 thermal resistance ambient temperature ta[ ? ] chip surface temperature tj[ ? ] power consumption p[w] h+ h- 1k 1k vcc a1,a2 15k al ? reduce by 6.24 mw/c over 25c. (70.0mm 70.0mm 1.6mm glass epoxy board) fig.12 thermal derating curve product structure silicon monolithic integrated circuit this product is not designed protection against radioactive rays 9/12 datasheet datasheet tsz02201-0h1h0b100480-1-2 ? 2012 rohm co., ltd. all rights reserved. 18.dec.2012 rev.002 tsz22111 ~ 14~ 001 BA6406F www.rohm.com ? safety measure 1) reverse connection protection diode reverse connection of power results in ic destruction as shown in fig 13. when reverse connection is possible, reverse connection protection diode must be added between power supply and vcc. fig.13 current flow when power is connected reversely 2) about measures of voltage ri se by back electromotive force the voltage of output terminal rises by back electromotive force. the diode d1 of fig.14 is necessary to divide a power supply line of motor with small signal line, so that the voltage of the output does not affect a power supply line. fig.14 separation of a power supply line 3) al output fig.15 protection of al terminal al output is an open collector and requires pull-up resistor. the ic can be protected by adding resistor r1. an exce ss of absolute maximum rating, when al output terminal is directly connected to power supply, could damage the ic. vcc gnd vcc gnd vcc gnd internal circuit impedance high ? amperage small circuit block each pin in normal ener g ization large current flows ? thermal destruction each pin circuit block reverse power connection no destruction each pin circuit block after reverse connection destruction prevention protection resistor r1 connector of board al pull-up resistor vcc ic d1 product structure silicon monolithic integrated circuit this product is not designed protection against radioactive rays 10/12 datasheet datasheet tsz02201-0h1h0b100480-1-2 ? 2012 rohm co., ltd. all rights reserved. 18.dec.2012 rev.002 tsz22111 ~ 14~ 001 BA6406F www.rohm.com 4) problem of gnd line pwm switching do not perform pwm switching of gnd line because gnd terminal potential cannot be kept to a minimum. fig.16 gnd line pwm switching prohibited pwm input prohibite vcc moto r driver gnd controller product structure silicon monolithic integrated circuit this product is not designed protection against radioactive rays 11/12 datasheet datasheet tsz02201-0h1h0b100480-1-2 ? 2012 rohm co., ltd. all rights reserved. 18.dec.2012 rev.002 tsz22111 ~ 14~ 001 BA6406F www.rohm.com ? operational notes 1) absolute maximum ratings an excess in the absolute maximum rations, such as supply voltage, temperature range of operating conditions, etc., can break down the devices, thus making impossible to i dentify breaking mode, such as a short circuit or an open circuit. if any over rated values will expect to exceed the absolute maximum ratings, consider adding circuit protection devices, such as fuses. 2) connecting the power supply connector backward connecting of the power supply in reverse polarity can damage ic. take precautions when connecting the power supply lines. an external direction diode can be added. 3) power supply line back electromotive force causes regenerated current to power supply line, therefore take a measure such as placing a capacitor between power supply and gnd for routing regenerated current. and fully ensure that the capacitor characteristics have no problem before determine a capacitor value. (when applying electrolytic capacitors, capacitance characteristic values are reduced at low temperatures) 4) gnd potential the potential of gnd pin must be minimum potential in all operating conditions. also ensure that all terminals except gnd terminal do not fall below gnd voltage including transient characteristics. however, it is possible that the motor output terminal may deflect below gnd because of influence by back electromotive force of motor. malfunction may possibly occur depending on use condition, environment, and property of individual motor. please make fully confirmation that no problem is found on operation of ic. 5) thermal design use a thermal design that allows for a sufficient margin in light of the power dissipation(pd) in actual operating conditions. 6) inter-pin shorts and mounting errors use caution when positioning the ic for mounting on print ed circuit boards. the ic may be damaged if there is any connection error or if pins are shorted together. 7) actions in strong electromagnetic field use caution when using the ic in the presence of a strong electromagnetic field as doing so may cause the ic to malfunction. 8) aso when using the ic, set the output transistor so that it does not exceed absolute maximum rations or aso. 9) testing on application boards when testing the ic on an application board, connecting a capacitor to a pin with low impedance subjects the ic to stress. always discharge capacitors after each process or step. always turn the ic?s power supply off before connecting it to or removing it from a jig or fixture durin g the inspection process. ground the ic during assembly steps as an antistatic measure. use similar prec aution when transporting or storing the ic. 10) gnd wiring pattern when using both small signal and large current gnd patterns, it is recommended to isolate the two ground patterns, placing a single ground point at the ground potential of application so that the pattern wiring resistance and voltage variations caused by large currents do not cause variations in the small signal ground voltage. be careful not to change the gnd wiring pattern of any external components, either. 11) capacitor between output and gnd when a large capacitor is connected between output and gnd, if v cc is shorted with 0v or gnd for some cause, it is possible that the current charged in the capacitor may flow into the output resulting in destruction. keep the capacitor between output and gnd below 100uf. 12) ic terminal input when vcc voltage is not applied to ic, do not apply voltage to each input terminal. when voltage above vcc or below gnd is applied to the input terminal, parasitic element is ac tuated due to the structure of ic. operation of parasitic element causes mutual interference between circuits, resulting in malfunction as well as destruction in the last. do not use in a manner where parasitic element is actuated. product structure silicon monolithic integrated circuit this product is not designed protection against radioactive rays 12/12 datasheet datasheet tsz02201-0h1h0b100480-1-2 ? 2012 rohm co., ltd. all rights reserved. 18.dec.2012 rev.002 tsz22111 ~ 14~ 001 BA6406F www.rohm.com ? physical dimension tape and reel information ? marking diagram ? order quantity needs to be multiple of the minimum quantity. datasheet d a t a s h e e t notice - ge rev.002 ? 2014 rohm co., ltd. all rights reserved. notice precaution on using rohm products 1. our products are designed and manufac tured for application in ordinary elec tronic equipments (such as av equipment, oa equipment, telecommunication equipment, home electroni c appliances, amusement equipment, etc.). if you intend to use our products in devices requiring ex tremely high reliability (such as medical equipment (note 1) , transport equipment, traffic equipment, aircraft/spacecra ft, nuclear power controllers, fuel c ontrollers, car equipment including car accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property (?specific applications?), please consult with the rohm sale s representative in advance. unless otherwise agreed in writing by rohm in advance, ro hm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any ro hm?s products for specific applications. (note1) medical equipment classification of the specific applications japan usa eu china class class class b class class class 2. rohm designs and manufactures its products subject to strict quality control system. however, semiconductor products can fail or malfunction at a certain rate. please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe desi gn against the physical injury, damage to any property, which a failure or malfunction of our products may cause. the following are examples of safety measures: [a] installation of protection circuits or other protective devices to improve system safety [b] installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. our products are designed and manufactured for use under standard conditions and not under any special or extraordinary environments or conditio ns, as exemplified below. accordin gly, rohm shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of an y rohm?s products under any special or extraordinary environments or conditions. if you intend to use our products under any special or extraordinary environments or conditions (as exemplified bel ow), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] use of our products in any types of liquid, incl uding water, oils, chemicals, and organic solvents [b] use of our products outdoors or in places where the products are exposed to direct sunlight or dust [c] use of our products in places where the products ar e exposed to sea wind or corrosive gases, including cl 2 , h 2 s, nh 3 , so 2 , and no 2 [d] use of our products in places where the products are exposed to static electricity or electromagnetic waves [e] use of our products in proximity to heat-producing components, plastic cords, or other flammable items [f] sealing or coating our products with resin or other coating materials [g] use of our products without cleaning residue of flux (ev en if you use no-clean type fluxes, cleaning residue of flux is recommended); or washing our products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] use of the products in places subject to dew condensation 4. the products are not subjec t to radiation-proof design. 5. please verify and confirm characteristics of the final or mounted products in using the products. 6. in particular, if a transient load (a large amount of load applied in a short per iod of time, such as pulse. is applied, confirmation of performance characteristics after on-boar d mounting is strongly recomm ended. avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading c ondition may negatively affect product performance and reliability. 7. de-rate power dissipation (pd) depending on ambient temper ature (ta). when used in seal ed area, confirm the actual ambient temperature. 8. confirm that operation temperat ure is within the specified range descr ibed in the product specification. 9. rohm shall not be in any way responsible or liable for fa ilure induced under deviant condi tion from what is defined in this document. precaution for mounting / circuit board design 1. when a highly active halogenous (chlori ne, bromine, etc.) flux is used, the resi due of flux may negatively affect product performance and reliability. 2. in principle, the reflow soldering method must be used; if flow soldering met hod is preferred, please consult with the rohm representative in advance. for details, please refer to rohm mounting specification datasheet d a t a s h e e t notice - ge rev.002 ? 2014 rohm co., ltd. all rights reserved. precautions regarding application examples and external circuits 1. if change is made to the constant of an external circuit, pl ease allow a sufficient margin c onsidering variations of the characteristics of the products and external components, including transient characteri stics, as well as static characteristics. 2. you agree that application notes, re ference designs, and associated data and in formation contained in this document are presented only as guidance for products use. theref ore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgment in the use of such information contained in this document. rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. precaution for electrostatic this product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. please take proper caution in your manufacturing process and storage so that voltage exceeding t he products maximum rating will not be applied to products. please take special care under dry condit ion (e.g. grounding of human body / equipment / solder iron, isolation from charged objects, se tting of ionizer, friction prevention and temperature / humidity control). precaution for storage / transportation 1. product performance and soldered connections may deteriora te if the products are stor ed in the places where: [a] the products are exposed to sea winds or corros ive gases, including cl2, h2s, nh3, so2, and no2 [b] the temperature or humidity exceeds those recommended by rohm [c] the products are exposed to di rect sunshine or condensation [d] the products are exposed to high electrostatic 2. even under rohm recommended storage c ondition, solderability of products out of recommended storage time period may be degraded. it is strongly recommended to confirm sol derability before using products of which storage time is exceeding the recommended storage time period. 3. store / transport cartons in the co rrect direction, which is indicated on a carton with a symbol. otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. use products within the specified time after opening a hum idity barrier bag. baking is required before using products of which storage time is exceeding the recommended storage time period. precaution for product label qr code printed on rohm products label is for rohm?s internal use only. precaution for disposition when disposing products please dispose them proper ly using an authorized industry waste company. precaution for foreign exchange and foreign trade act since our products might fall under cont rolled goods prescribed by the applicable foreign exchange and foreign trade act, please consult with rohm representative in case of export. precaution regarding intellectual property rights 1. all information and data including but not limited to application example contain ed in this document is for reference only. rohm does not warrant that foregoi ng information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. rohm shall not be in any way responsible or liable for infringement of any intellectual property rights or ot her damages arising from use of such information or data.: 2. no license, expressly or implied, is granted hereby under any intellectual property rights or other rights of rohm or any third parties with respect to the information contained in this document. other precaution 1. this document may not be reprinted or reproduced, in whol e or in part, without prior written consent of rohm. 2. the products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of rohm. 3. in no event shall you use in any wa y whatsoever the products and the related technical information contained in the products or this document for any military purposes, incl uding but not limited to, the development of mass-destruction weapons. 4. the proper names of companies or products described in this document are trademarks or registered trademarks of rohm, its affiliated companies or third parties. datasheet datasheet notice ? we rev.001 ? 2014 rohm co., ltd. all rights reserved. general precaution 1. before you use our pro ducts, you are requested to care fully read this document and fully understand its contents. rohm shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny rohms products against warning, caution or note contained in this document. 2. all information contained in this docume nt is current as of the issuing date and subj ec t to change without any prior notice. before purchasing or using rohms products, please confirm the la test information with a rohm sale s representative. 3. the information contained in this doc ument is provi ded on an as is basis and rohm does not warrant that all information contained in this document is accurate an d/or error-free. rohm shall not be in an y way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or concerning such information. datasheet part number BA6406F package sop8 unit quantity 2500 minimum package quantity 2500 packing type taping constitution materials list inquiry rohs yes BA6406F - web page distribution inventory |
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